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Vaccum type system
3SP Fully Automatic Printer + CCD:DIP-3SP series
| Description | General Specifications | ||
|---|---|---|---|
| Use | A system that fills and prints via holes on a PCB board and removes voids with a vacuum chamber. | ||
| Model name | DIP-3SP SERIES+VCD | ||
| Board size | W510 x L515mm | ||
| Substrate thickness | 0.2 ~ 2.5mm | ||
| Tact | Less than 20 sec/panel | ||
| Degree of vacuum | Possible below 110 Pa (applied to Kasiyama pump in Japan) |
Product Description
Characteristic
1. Via hole plugging printing is possible without void
2. 2 Equipped with a system that matches the jig to the substrate and the substrate to the plate by CCD
3. Ink supply device (vacuum defoaming, mixing, preheating) installed
4. Safety devices for worker safety
5. Squeegee pressure precision control system (Option)
- Prev.Vacuum printing machine : DVP515 series 24.11.21
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